semiconductor chip sim semiconductor chip making machine fabrica de semiconductores chip

This is the leftover material after Jin Yuan is cut, and the wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair.

 

This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers can be removed for uncut material and defective products. Market uses are as follows:

5nm wafer 5NANO technology wafer component chip applications cover:

A large number of 5NANO 12” wafer processes use EUV (Extreme Ultraviolet Photolithography) technology that will continue to improve EUV’s production efficiency and yield technology. All three can be used in common.

㊀ The 12-inch 5nm chip is available in three sizes:

①.4*6m/m, ②.6*7m/m, ③.7*11m/m.

㊁The lithography line is made:

①.4*6mm is an area of ​​24 square millimeters, and each square millimeter has more than 177 million transistors implanted, that is, about 4.248 billion transistors, and the conversion access memory = 512MB capacity.

②.6*7mm, with a total of 7.434 billion transistors, equivalent to 1GB capacity.

③.7*11mm, there are 13.629 billion transistors in total, which is equivalent to 1.5G capacity.

Quantity: A total of 1000 boxes per month can be ordered (1.2 million pieces) / minimum order of 40 boxes (9600 pieces),

Try a box of 240 pieces. (Sample price USD 7 / PCS).

Supply period: long orders can be signed and delivered in batches

Product Specifications:

Several key points of wafer tailing processing are explained:

Global standard 12”5Nano wafer wafer, the outer periphery of each film is approximately

Size- A 4mm * 6mm.(About 70 to 110 chips) Size- B 6mm * 7mm.(About 40 to 50 chips) Size- C 7mm * 11mm.(About 16 to 24 chips)

 

Packaged form: Including SoIC (system integrated chip), InFO (integrated fan-out packaging technology),

3DIC technology platforms such as CoWoS (Chip on Substrate Packaging), these 5nm chips are all suitable for fan in or fanout type advanced packaging technology. Although QFN, SOP, LQF, and these are all too low-end, they can all be packaged. If a lower-end packaging technology is used, it depends on the matching with the carrier board.

Package:

Carton packaging. 1kg is 80 pieces.

By air it is 3kg per box (240 pieces) By sea it is 15kg per box (1200 pieces)

The container is 1000 boxes (1.2 million pieces) 15 tons in weight

Five-nanometer wafer sample testing identifies detailed data descriptions:

The level of packaging technology requires a "five-nanometer chip" packaging factory to detect, and the packaging results are necessary and necessary to apply high-tech righteousness. "Optoelectronics Technology Professional Instrument" can detect more than 1....7E per cubic millimeter. "Transistor Structure" This instrument has 3D comprehensive functions.

Provide test data in Taiwan:

Excerpted from the Internet, for reference only
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